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? 2000 microchip technology inc. ds51194d-page 1 introduction this document describes the transition sockets used with mplab-ice, microchip?s in-circuit emulator. figure 1: mplab-ice emulator system what are transition sockets? transition sockets are devices that allow mplab-ice device adaptors to interface to sockets on customer products that differ from the standard emulator adapter connection. embedded microcontrollers/microprocessors come in many dif- ferent types of ic packages, i.e., dip, plcc, soic, ssop, mqfp, etc. typically, development cycle components are eprom based and, as a result, are provided in larger windowed package formats such as dip or plcc. production components are primarily preprogrammed rom, otp or flash-based and are often in very compact soic, ssop, mqfp or pqfp package for- mats. the mplab-ice solution is transition sockets. a transition socket is specifically designed to provide compatibility between two dif- fering types of ic package formats. parallel cable power supply cable emulator pod processor module with cable logic probe connector device adapter transition socket transition socket specifications mplab ? -ice
mplab ? -ice ds51194d-page 2 ? 2000 microchip technology inc. transition sockets are typically composed of two parts: the dip adapter socket and the soic/ssop header. the dip adapter socket is designed to plug into the emulator system?s dip device adapter on one side and the header on the other. the header is then soldered down to the target application. the qfp adapter is a single part soldered directly to the target application and fits into the qfp device adapter. why should i use transition sockets in my product design? there are two very significant advantages to using transition sockets: 1. a shorter product development cycle, and 2. reduced expense in the design, layout, and prototype testing. a typical product design cycle has two important phases: the pro- totype design phase and the production design phase. tradition- ally, these phases were different simply because the prototype used a microcontroller with a different package type. however, with the availability of the transition sockets, the prototype design can be identical to the production design because a transition socket can be used to bridge the microcontroller package differ- ences. what are the currently available transition sockets? microchip technology currently offers the following transition sockets for use with our emulator systems: pdip ? 28-lead, 0.300-inch male to 0.600-inch female soic ? 8-, 14-, 18-, 20- and 28-lead ssop ? 20- and 28-lead qfp ? 44-, 64- and 80-lead please check the microchip web site (www.microchip.com) for the most current version of this document.
mplab ? -ice ? 2000 microchip technology inc. ds51194d-page 3 how can i obtain maximum benefit from the use of transition sockets? attention to component placement should be considered to pro- vide adequate clearance for the transition socket interface to the pcb footprint. this is especially true for any tall components such as connector headers, radial components or voltage regu- lators. refer to the transition socket mechanical drawings for dimensions. comments and suggestions on transition socket applications attention to component placement should be considered in mat- ing the adapter sockets to the soic/ssop headers. if visual alignment is difficult in your application, c-shaped end brackets have been included to aid in header-to-adapter socket alignment. clip the brackets onto the soic/ssop header. the placement of via?s around the surface mount technology (smt) layout area should be examined. via?s immediately adja- cent to the end of a smt pad may inadvertently come into contact with the header leads. via?s should be placed along the center- line of the smt pad to lessen the chance of pin to pin shorts while soldering. the soic header is designed for soic body width of 0.300-inch, the adapter leads should be cut to fit the 0.150-inch and 0.208-inch soic body widths.
mplab?-ice ds51194d-page 4 ? 2000 microchip technology inc. xlt28xp 28-lead dip 0.300-inch male to 0.600-inch female adapter socket .............................................................7 xlt08so 8-lead dip to 0.050-inch adapter socket ....................9 8-lead soic header ..................................................10 xlt14so 14-lead dip to 0.050-inch adapter socket ................11 14-lead soic header ................................................12 xlt18so 18-lead dip to 0.050-inch adapter socket ................13 18-lead soic header ...............................................14 xlt20so1 20-lead dip to 0.050-inch adapter socket ................15 20-lead soic header ...............................................16 xlt28so 28-lead dip to 0.050-inch adapter socket ................17 28-lead soic header ................................................18 XLT20SS 18-lead dip to 0.8 mm adapter socket .....................20 20-lead ssop header ..............................................21 XLT20SS1 20-lead dip to 0.8 mm adapter socket .....................22 20-lead ssop header ..............................................23 xlt28ss, xlt28ss2 28-lead dip to 0.8 mm adapter socket .....................24 28-lead ssop header ..............................................25
mplab?-ice ? 2000 microchip technology inc. ds51194d-page 5 xlt44pt 44-lead transition socket ? top view ..................... 29 44-lead transition socket ? side view ....................30 xlt64pt1, xlt64pt2, xlt80pt 64/80-lead transition socket ? top view ................31 64/80-lead transition socket ? side view ............... 32
mplab ? -ice ds51194d-page 6 ? 2000 microchip technology inc. pdip transition socket a pdip transition socket and associated hardware is shown in figure 2. figure 2: pdip transition socket the pdip transition socket is a 0.300-inch male to 0.600-inch female adapter socket. microchip offers the following pdip transition socket: xlt28xp: one 28-lead pdip adapter socket and two 28-lead gold stand-offs see the drawings in this section for layout dimensions. cable to processor module pdip type device adapter gold standoffs / adapters 0.300-inch male to 0.600-inch female adapter socket target / application board (pdip transition socket)
mplab ? -ice ? 2000 microchip technology inc. ds51194d-page 7 xlt28xp 28-lead dip 0.300-inch male to 0.600-inch female adapter socket 0.300" 0.100" 0.600" 1.400" 0.700" top view side view rear view front/
mplab ? -ice ds51194d-page 8 ? 2000 microchip technology inc. soic transition socket an soic transition socket and associated hardware is shown in figure 3. figure 3: soic transition socket there are two components of the soic transition socket. 1. adapter socket that connects to the pdip device adapter. 2. soic header that is to be soldered down to the target appli- cation. microchip offers the following soic transition sockets: xlt08so:one adapter socket and three 8-lead soic headers xlt14so:one adapter socket and three 14-lead soic headers xlt18so:one adapter socket and three 18-lead soic headers xlt20so1:one adapter socket and three 20-lead soic headers xlt28so:one adapter socket and three 28-lead soic headers see the drawings in this section for layout dimensions. note: the soic header is designed for soic body width of 0.300 inch. the adapter leads should be cut to fit the 0.150-inch and 0.208-inch soic body widths. cable to processor module pdip type device adapter gold standoffs / adapters adapter socket soic header target / application board soic transition socket
mplab ? -ice ? 2000 microchip technology inc. ds51194d-page 9 xlt08so 8-lead dip to 0.050-inch adapter socket top view side view rear view front/ bottom view
mplab ? -ice ds51194d-page 10 ? 2000 microchip technology inc. 8-lead soic header g f e d c b a 0.060 0.410 0.050 0.075 0.178 0.050 0.050 a b c d e f g unless otherwise specified, dimensions are in inches. the soic header is designed for an soic body width of 0.300 inch. the adapter leads should be cut to fit the 0.150-inch and 0.208-inch soic body widths. top view side view front/ rear view
mplab ? -ice ? 2000 microchip technology inc. ds51194d-page 11 xlt14so 14-lead dip to 0.050-inch adapter socket top view side view rear view front/ bottom view
mplab ? -ice ds51194d-page 12 ? 2000 microchip technology inc. 14-lead soic header a b c d e f g g f e d c b a 0.060 0.410 0.050 0.075 0.178 0.050 0.050 top view side view unless otherwise specified, dimensions are in inches. the soic header is designed for an soic body width of 0.300 inch. the adapter leads should be cut to fit the 0.150-inch and 0.208-inch soic body widths. front/ rear view
mplab ? -ice ? 2000 microchip technology inc. ds51194d-page 13 xlt18so 18-lead dip to 0.050-inch adapter socket top view side view rear view front/ bottom view
mplab ? -ice ds51194d-page 14 ? 2000 microchip technology inc. 18-lead soic header a b c d e f g g f e d c b a 0.060 0.410 0.050 0.075 0.178 0.050 0.050 top view side view unless otherwise specified, dimensions are in inches. the soic header is designed for an soic body width of 0.300 inches. the adapter leads should be cut to fit the 0.150inch and 0.208-inch soic body widths. front/ rear view
mplab ? -ice ? 2000 microchip technology inc. ds51194d-page 15 xlt20so1 20-lead dip to 0.050-inch adapter socket top view side view rear view front/ bottom view
mplab ? -ice ds51194d-page 16 ? 2000 microchip technology inc. 20-lead soic header a b c d e f g g f e d c b a 0.060 0.410 0.050 0.075 0.178 0.050 0.050 top view side view unless otherwise specified, dimensions are in inches. the soic header is designed for an soic body width of 0.300 inches. the adapter leads should be cut to fit the 0.150inch and 0.208-inch soic body widths. front/ rear view
mplab ? -ice ? 2000 microchip technology inc. ds51194d-page 17 xlt28so 28-lead dip to 0.050-inch adapter socket top view side view rear view front/ bottom view
mplab ? -ice ds51194d-page 18 ? 2000 microchip technology inc. 28-lead soic header a b c d e f g g f e d c b a 0.060 0.410 0.050 0.075 0.178 0.050 0.050 top view side view unless otherwise specified, dimensions are in inches. the soic header is designed for an soic body width of 0.300 inches. the adapter leads should be cut to fit the 0.150-inch and 0.208-inch soic body widths. front/ rear view
mplab ? -ice ? 2000 microchip technology inc. ds51194d-page 19 ssop transition socket an ssop transition socket and associated hardware is shown in figure 4. figure 4: ssop transition socket the ssop transition sockets are similar to the soic transition sockets. there are two parts to the ssop transition socket: 1. adapter socket that connects to the pdip device adapter. 2. ssop header that gets soldered down to the target applica- tion. microchip offers the following ssop transition sockets: XLT20SS: one adapter socket and three 20-lead ssop headers XLT20SS1: one adapter socket and three 20-lead ssop headers xlt28ss: one adapter socket and three 28-lead ssop headers xlt28ss2: one adapter socket and three 28-lead ssop headers for pic16c55/57. see the drawings in this section for layout dimensions and clear- ances for tall components. note: to keep the leads straight during assembly and ship- ping, the ssop headers are shipped with break-away tabs attached to the leads. please remove the break- away tabs before applying power to the target system. be careful not to bend the leads prior to soldering to the target application. cable to processor module pdip device adapter gold standoffs / adapters adapter socket ssop header target / application board ssop transition socket
mplab ? -ice ds51194d-page 20 ? 2000 microchip technology inc. XLT20SS 18-lead dip to 0.8 mm adapter socket top view side view rear view front/ bottom view
mplab ? -ice ? 2000 microchip technology inc. ds51194d-page 21 20-lead ssop header g f e d c b a 0.040 0.295 0.026 0.075 0.190 0.047 0.0315 a b c d e f g shipped with break- away tabs attached to leads remove prior to providing power * top drawing shown with clip-on shrouds installed unless otherwise specified, dimensions are in inches. break away tabs are to be removed prior to providing power. top view side view front/ rear view
mplab ? -ice ds51194d-page 22 ? 2000 microchip technology inc. XLT20SS1 20-lead dip to 0.8 mm adapter socket top view side view rear view front/ bottom view
mplab ? -ice ? 2000 microchip technology inc. ds51194d-page 23 20-lead ssop header g f e d c b a 0.040 0.295 0.026 0.075 0.190 0.047 0.0315 a b c d e f g shipped with break- away tabs attached to leads remove prior to providing power * top drawing shown with clip-on shrouds installed unless otherwise specified, dimensions are in inches. break away tabs are to be removed prior to providing power. top view side view front/ rear view
mplab ? -ice ds51194d-page 24 ? 2000 microchip technology inc. xlt28ss, xlt28ss2 28-lead dip to 0.8 mm adapter socket top view side view rear view front/ bottom view
mplab ? -ice ? 2000 microchip technology inc. ds51194d-page 25 28-lead ssop header a b c d e f g shipped with break- away tabs attached to leads remove prior to applying power. * top drawing shown with clip-on shrouds installed top view front/ rear side view g f e d c b a 0.040 0.295 0.026 0.075 0.190 0.047 0.0315 unless otherwise specified, dimensions are in inches. break away tabs are to be removed prior to applying power. view
mplab ? -ice ds51194d-page 26 ? 2000 microchip technology inc. mqfp/tqfp transition socket an mqfp/tqfp transition socket and associated hardware is shown in figure 5. figure 5: mqfp/tqfp transition socket the mqfp/tqfp transition socket is required for use along with the mqfp/tqfp device adapters. the device adapter is equipped with four socket strips that interface with the transition socket. microchip offers the following mqfp/tqfp transition sockets: xlt44pt: one 44-lead mqfp/tqfp transition socket xlt64pt1 one 64-lead mqfp/tqfp transition socket, pic16c92x xlt64pt2: one 64-lead mqfp/tqfp transition socket, pic17cxxx xlt80pt: one 80-lead mqfp/tqfp transition socket note: to avoid solder bridging, do not place via?s within 0.025- inch of the mqfp/tqfp footprint. also, any via?s near the mqfp/tqfp should be directly on the centerline of the pad. cable to processor module mqfp/tqfp device adapter mqfp/tqfp transition socket target / application board
mplab ? -ice ? 2000 microchip technology inc. ds51194d-page 27 see the drawings in this section for layout dimensions and clear- ances for tall components. note: the xlt64pt1 for the pic16c92x is not symmetrical. please note pin 1 orientation prior to soldering to the tar- get system. top view 1 st92x pin 1
mplab ? -ice ds51194d-page 28 ? 2000 microchip technology inc. tqfp transition socket soldering tips before soldering, consider keeping the break away tabs in place during soldering. use controlled soldering iron tip temperatures between 300 and 325 c (570 to 615 f) if it is possible, use a pace mini wave soldering iron tip or an equivalent tip design. plan to solder one (1 of 4) side first, then the opposite side, then remaining two sides. soldering iron tip movement should be in direction of the leads (backward and forward), not across the leads; dragging the tip across the leads may cause lead dam- age. use generous amounts of soldering flux to aid in the solder flow action. if the breakaway tabs are removed after soldering (using a dental pick or equivalent), any solder bridging between leads can be repaired by simply gently touch- ing the soldering tip to the lead tip. remember the 64- and 80-pin tqfp headers are very del- icate and can be damaged!
mplab ? -ice ? 2000 microchip technology inc. ds51194d-page 29 xlt44pt 44-lead transition socket ? top view unless otherwise specified, dimensions are in inches. a a 0.90 top view
mplab ? -ice ds51194d-page 30 ? 2000 microchip technology inc. 44-lead transition socket ? side view unless otherwise specified, dimensions are in inches. gj fh e d c b h j b c d e f g 0.80 0.65 0.55 0.365 0.05 0.275 0.80 mm 0.130 side view
mplab ? -ice ? 2000 microchip technology inc. ds51194d-page 31 xlt64pt1, xlt64pt2, xlt80pt 64/80-lead transition socket ? top view a a unless otherwise specified, dimensions are in inches. drawing shown is for 64-lead. this drawing shown with break away tabs attached to the leads. break away tabs are to be removed prior to applying power. a 1.25 top view 1.45 64 lead 80 lead
mplab ? -ice ds51194d-page 32 ? 2000 microchip technology inc. 64/80-lead transition socket ? side view unless otherwise specified, dimensions are in inches. drawing shown is for 64-lead. break away tabs are to be removed prior to applying power. b c e f g h j side view gj fh e c b 0.95 0.500 0.400 0.05 0.275 0.5 mm 0.095 1.15 0.575 0.475 0.05 0.275 0.5 mm 0.095 64 lead 80 lead
mplab ? -ice ? 2000 microchip technology inc. ds51194d-page 33 notes:
mplab ? -ice ds51194d-page 34 ? 2000 microchip technology inc. notes:
mplab ? -ice ? 2000 microchip technology inc. ds51194d-page 35 notes:
ds51194d-page 36 2000 microchip technology inc. information contained in this publication regarding device applications and the like is intended for suggestion only and may be superseded by updates. no representation or warranty is given and no liability is assumed by microchip technology incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of microchip?s products as critical components in life support systems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or otherwise, under any intellectual property rights. the microchip logo and name are registered trademarks of microchip technology inc. in the u.s.a. and other countries. all rights reserved. all other trademarks mentioned herein are the property of their respective companies. all rights reserved. ? 6/00 microchip technology incorporated. printed in the usa. 6/00 printed on recycled paper. worldwide sales and service americas corporate office tel: 480-786-7200 technical support: 480-786-7627 atlanta tel: 770-640-0034 boston tel: 508-480-9990 chicago tel: 630-285-0071 dallas tel: 972-818-7423 dayton tel: 937-291-1654 detroit tel: 248-538-2250 los angeles tel: 949-263-1888 new york tel: 631-273-5305 san jose tel: 408-436-7950 to ro nt o tel: 905-405-6279 asia/ pac if ic china-beijing tel:86-10-85282100 china-shanghai tel: 86-21-6275-5700 hong kong tel: 852-2-401-1200 india tel: 91-80-229-0061 japan tel: 81-45-471- 6166 korea tel: 82-2-554-7200 singapore tel: 65-334-8870 tai wan tel: 886-2-2717-7175 europe denmark tel: 45-4420-9895 france tel: 33-1-69-53-63-20 germany tel: 49-89-627-144 0 italy tel: 39-039-65791-1 united kingdom tel: 44 118 921 5858 05/16/00 microchip received qs-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona in july 1999. the company?s quality system processes and procedures are qs- 9000 compliant for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms and microperipheral products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001 certified.

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